4 修訂歷史記錄

Changes from M Revision (June 2015) to N Revision

• Changed YZP package pinout drawing to match mechanical data drawing; and, pin functions description for clarity Go
• Added additional thermal metrics for all packages.Go
• Added detailed feature description sections for Standard CMOS Inputs, Balanced High-Drive CMOS Push-Pull Outputs, and Negative Clamping Diodes.Go
• Added improved Design Requirements and Detailed Design Procedure.Go
• Changed verbiage to better reflect recommendations for this specific device rather than logic devices in general.Go
• Added layout example for the YZP package.Go

Changes from L Revision (January 2014) to M Revision

• Added ESD Ratings table.Go
• Added Thermal Information table.Go
• Added Typical CharacteristicsGo
• Added 機械、封裝和可訂購信息 部分。Go

Changes from K Revision (January 2007) to L Revision

• 將文檔更新為新的 TI 數(shù)據(jù)表格式。Go
• 刪除了訂購信息 表Go
• 已更新特性Go
• Added 器件信息 表Go