ZHCSJI5N April 1999 – March 2019 SN74LVC2G157
PRODUCTION DATA.
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74LVC2G157 | UNIT | |||
|---|---|---|---|---|---|
| DCT (SSOP) | DCU (VSSOP) | YZP (DSBGA) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 192.0 | 289.9 | 99.9 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 70.2 | 86.9 | 1.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 105.2 | 208.5 | 27.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.7 | 23.1 | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 103.6 | 206.5 | 27.8 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |