ZHCSYD4R June 2001 – June 2025 SN74LVC1G66
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74LVC1G66 | UNIT | ||||||
|---|---|---|---|---|---|---|---|---|
| DBV (SOT-23) | DCK (SC70) | DRL (SOT) | DRY (USON) | DSF (X2SON) | YZP (DSBGA) | |||
| 5 PINS | 5 PINS | 5 PINS | 6 PINS | 6 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 262 | 313 | 142 | 355 | 348 | 132 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 198 | 203 | — | 250 | 215 | — | °C/W |
| RθJB | Junction-to-board thermal resistance | 142 | 195 | — | 222 | 211 | — | °C/W |
| ΨJT | Junction-to-top characterization parameter | 123 | 120 | — | 78 | 35 | — | °C/W |
| ΨJB | Junction-to-board characterization parameter | 142 | 194 | — | 221 | 210 | — | °C/W |