ZHCSTJ8B May 2001 – October 2023 SN65LBC182 , SN75LBC182
PRODUCTION DATA
| THERMAL METRIC(1) | D (SOIC) | P (PDIP) | UNIT | |
|---|---|---|---|---|
| 8-PINS | ||||
| R θJA | Junction-to-ambient thermal resistance | 116.7 | 84.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | 65.4 | °C/W |
| R θJB | Junction-to-board thermal resistance | 63.4 | 62.1 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 8.8 | 31.3 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 62.6 | 60.4 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |