ZHCSH84A September 2017 – December 2017 SN55HVD233-SP
PRODUCTION DATA.
| THERMAL METRIC(2)(1) | SN55HVD233-SP | UNIT | |
|---|---|---|---|
| HKX (CFP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 97.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 21.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 79.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 73.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.0 | °C/W |