ZHCSKL3C December 2019 – May 2024 LP8866-Q1
PRODUCTION DATA
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage on pins | VSENSE_N, SD, UVLO | –0.3 | VSENSE_P + 0.3 | V |
| Voltage on pins | VSENSE_P, FB, DISCHARGE, OUT1 to OUT6 | –0.3 | 52 | V |
| C1N, C1P, VDD, EN, ISNS, ISNS_GND, INT, MODE, PWM_FSET, BST_FSET, LED_SET, ISET, GD and CPUMP | –0.3 | 6 | V | |
| Voltage on pins | PWM, BST_SYNC, SDA, SCL | –0.3 | VDD + 0.3 | V |
| Continuous power dissipation(4) | Internally Limited | W | ||
| Thermal | Ambient temperature, TA(3) | –40 | 125 | |
| Junction temperature, TJ(3) | –40 | 150 | °C | |
| Lead temperature (soldering) | 260 | °C | ||
| Storage temperature, Tstg | –65 | 150 | °C | |