ZHCSGN5B March 2017 – July 2018 LP8863-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics
- 7.6 Protection Electrical Characteristics
- 7.7 LED Current Sink and LED PWM Electrical Characteristics
- 7.8 Power-Line FET and RISENSE Electrical Characteristics
- 7.9 Input PWM Electrical Characteristics
- 7.10 Boost Converter Electrical Characteristics
- 7.11 Oscillator
- 7.12 Charge Pump
- 7.13 Logic Interface Characteristics
- 7.14 Timing Requirements for SPI Interface
- 7.15 Timing Requirements for I2C Interface
- 7.16 Typical Characteristics
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1
FullMap Registers
- 8.6.1.1 BL_MODE Register (Offset = 20h) [reset = 300h]
- 8.6.1.2 DISP_BRT Register (Offset = 28h) [reset = 0h]
- 8.6.1.3 GROUPING1 Register (Offset = 30h) [reset = 0h]
- 8.6.1.4 GROUPING2 Register (Offset = 32h) [reset = 0h]
- 8.6.1.5 USER_CONFIG1 Register (Offset = 40h) [reset = 8B0h]
- 8.6.1.6 USER_CONFIG2 Register (Offset = 42h) [reset = 0h]
- 8.6.1.7 INTERRUPT_ENABLE_3 Register (Offset = 4Eh) [reset = 200Ah]
- 8.6.1.8 INTERRUPT_ENABLE_1 Register (Offset = 50h) [reset = A02Ah]
- 8.6.1.9 INTERRUPT_ENABLE_2 Register (Offset = 52h) [reset = 80h]
- 8.6.1.10 INTERRUPT_STATUS_1 Register (Offset = 54h) [reset = 0h]
- 8.6.1.11 INTERRUPT_STATUS_2 Register (Offset = 56h) [reset = 0h]
- 8.6.1.12 INTERRUPT_STATUS_3 Register (Offset = 58h) [reset = 0h]
- 8.6.1.13 JUNCTION_TEMPERATURE Register (Offset = E8h) [reset = 100h]
- 8.6.1.14 TEMPERATURE_LIMIT_HIGH Register (Offset = ECh) [reset = 7Dh]
- 8.6.1.15 TEMPERATURE_LIMIT_LOW Register (Offset = EEh) [reset = 69h]
- 8.6.1.16 CLUSTER1_BRT Register (Offset = 13Ch) [reset = FFFFh]
- 8.6.1.17 CLUSTER2_BRT Register (Offset = 148h) [reset = FFFFh]
- 8.6.1.18 CLUSTER3_BRT Register (Offset = 154h) [reset = FFFFh]
- 8.6.1.19 CLUSTER4_BRT Register (Offset = 160h) [reset = FFFFh]
- 8.6.1.20 CLUSTER5_BRT Register (Offset = 16Ch) [reset = FFFFh]
- 8.6.1.21 BRT_DB_CONTROL Register (Offset = 178h) [reset = 0h]
- 8.6.1.22 LED0_CURRENT Register (Offset = 1C2h) [reset = FFFh]
- 8.6.1.23 LED1_CURRENT Register (Offset = 1C4h) [reset = FFFh]
- 8.6.1.24 LED2_CURRENT Register (Offset = 1C6h) [reset = FFFh]
- 8.6.1.25 LED3_CURRENT Register (Offset = 1C8h) [reset = FFFh]
- 8.6.1.26 LED4_CURRENT Register (Offset = 1CAh) [reset = FFFh]
- 8.6.1.27 LED5_CURRENT Register (Offset = 1CCh) [reset = FFFh]
- 8.6.1.28 BOOST_CONTROL Register (Offset = 288h) [reset = 1C0h]
- 8.6.1.29 SHORT_THRESH Register (Offset = 28Ah) [reset = 2882h]
- 8.6.1.30 FSM_DIAGNOSTICS Register (Offset = 2A4h) [reset = 0h]
- 8.6.1.31 PWM_INPUT_DIAGNOSTICS Register (Offset = 2A6h) [reset = 0h]
- 8.6.1.32 PWM_OUTPUT_DIAGNOSTICS Register (Offset = 2A8h) [reset = 0h]
- 8.6.1.33 LED_CURR_DIAGNOSTICS Register (Offset = 2AAh) [reset = 0h]
- 8.6.1.34 ADAPT_BOOST_DIAGNOSTICS Register (Offset = 2ACh) [reset = 0h]
- 8.6.1.35 AUTO_DETECT_DIAGNOSTICS Register (Offset = 2AEh) [reset = 0h]
- 8.6.1
FullMap Registers
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1
Full Feature Application for Display Backlight
- 9.2.1.1 Design Requirements
- 9.2.1.2
Detailed Design Procedure
- 9.2.1.2.1 Inductor Selection
- 9.2.1.2.2 Output Capacitor Selection
- 9.2.1.2.3 Input Capacitor Selection
- 9.2.1.2.4 Charge Pump Output Capacitor
- 9.2.1.2.5 Charge Pump Flying Capacitor
- 9.2.1.2.6 Output Diode
- 9.2.1.2.7 Switching FET
- 9.2.1.2.8 Boost Sense Resistor
- 9.2.1.2.9 Power-Line FET
- 9.2.1.2.10 Input Current Sense Resistor
- 9.2.1.2.11 Feedback Resistor Divider
- 9.2.1.2.12 Critical Components for Design
- 9.2.1.3 Application Curves
- 9.2.2 Application With Basic/Minimal Operation
- 9.2.3
SEPIC Mode Application
- 9.2.3.1 Design Requirements
- 9.2.3.2
Detailed Design Procedure
- 9.2.3.2.1 Inductor Selection
- 9.2.3.2.2 Coupling Capacitor Selection
- 9.2.3.2.3 Output Capacitor Selection
- 9.2.3.2.4 Input Capacitor Selection
- 9.2.3.2.5 Charge Pump Output Capacitor
- 9.2.3.2.6 Charge Pump Flying Capacitor
- 9.2.3.2.7 Switching FET
- 9.2.3.2.8 Output Diode
- 9.2.3.2.9 Switching Sense Resistor
- 9.2.3.2.10 Power-Line FET
- 9.2.3.2.11 Input Current Sense Resistor
- 9.2.3.2.12 Feedback Resistor Divider
- 9.2.3.2.13 Critical Components for Design
- 9.2.3.3 Application Curves
- 9.2.1
Full Feature Application for Display Backlight
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
8.5.2 SPI Interface
In SPI mode host can address as many unique LP8863-Q1 devices as there are slave select pins on host. The complete 10-bit register space in LP8863-Q1 device can be accessed using SPI interface.
The LP8863-Q1 device is compatible with SPI serial-bus specification and operates as a slave device. The transmission consists of 32-bit write and read cycles. One cycle consists of a 15-bit register address (10 bits used), 1 read/write (R/W) bit and 16-bit data to maintain compatibility with 16-bit SPI.
The R/W bit high state defines a write cycle and low defines a read cycle. The SDO output is normally in a high-impedance state. When the slave-select pin SS for the device is active (that is, low) the SDO output is pulled low. During write cycle SDO stays in high-impedance state. The address and data bits are transmitted MSB first. The slave-select signal SS must be low during the cycle transmission. SS resets the interface when high, and it has to be taken high between successive cycles, except when using auto- increment mode. Data is clocked in on the rising edge of the SCLK clock signal, while data is clocked out on the falling edge of SCLK.
Figure 30. SPI Write 
Figure 31. SPI Read