ZHCSGN5B March 2017 – July 2018 LP8863-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | LP8863 | UNIT | |
|---|---|---|---|
| DCP (HTSSOP) | |||
| 38 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 32.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 19.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |