SNVSBP2 February 2020 LP8758-E3
PRODUCTION DATA.
| THERMAL METRIC(1) | LP8758 | UNIT | |
|---|---|---|---|
| YFF (DSBGA) | |||
| 35 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 56.1 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 0.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.4 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | N/A | °C/W |