ZHCSIE3B June   2018  – May 2019 LMZM33606

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
   1.     簡(jiǎn)化電路原理圖
3. 3 說明
   1.     最小解決方案尺寸
   2.     典型效率（自動(dòng)模式）
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Switching Characteristics
   7. 6.7 Typical Characteristics (VIN = 12 V)
   8. 6.8 Typical Characteristics (VIN = 24 V)
   9. 6.9 Typical Characteristics (VIN = 36 V)
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Input Capacitor Selection
      3. 7.3.3  Output Capacitor Selection
      4. 7.3.4  Transient Response
      5. 7.3.5  Feed-Forward Capacitor
      6. 7.3.6  Switching Frequency (RT)
      7. 7.3.7  Synchronization (SYNC/MODE)
      8. 7.3.8  Output Enable (EN)
      9. 7.3.9  Programmable System UVLO (EN)
      10. 7.3.10 Internal LDO and BIAS_SEL
      11. 7.3.11 Power Good (PGOOD) and Power Good Pull-Up (PGOOD_PU)
      12. 7.3.12 Mode Select (Auto or FPWM)
      13. 7.3.13 Soft Start and Voltage Tracking
      14. 7.3.14 Voltage Dropout
      15. 7.3.15 Overcurrent Protection (OCP)
      16. 7.3.16 Thermal Shutdown
   4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Auto Mode
      3. 7.4.3 FPWM Mode
      4. 7.4.4 Shutdown Mode
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Output Voltage Setpoint
         2. 8.2.2.2 Setting the Switching Frequency
         3. 8.2.2.3 Input Capacitors
         4. 8.2.2.4 Output Capacitor Selection
         5. 8.2.2.5 Feed-Forward Capacitor (CFF)
         6. 8.2.2.6 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Theta JA vs PCB Area
    4. 10.4 Package Specifications
    5. 10.5 EMI
       1. 10.5.1 EMI Plots
11. 11器件和文檔支持
    1. 11.1 器件支持
       1. 11.1.1 第三方產(chǎn)品免責(zé)聲明
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 Glossary
12. 12機(jī)械、封裝和可訂購信息
    1. 12.1 Tape and Reel Information