ZHCSD26E August   2012  – August 2018 LMZ21701

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
   1.     Device Images
      1.      簡化原理圖
      2.      VIN = 12V 時的效率
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Package Construction
   4. 7.4 Feature Description
      1. 7.4.1 Input Undervoltage Lockout
      2. 7.4.2 Enable Input (EN)
      3. 7.4.3 Soft Start and Tracking Function (SS)
      4. 7.4.4 Power Good Function (PG)
      5. 7.4.5 Output Voltage Setting
      6. 7.4.6 Output Current Limit and Output Short Circuit Protection
      7. 7.4.7 Thermal Protection
   5. 7.5 Device Functional Modes
      1. 7.5.1 PWM Mode Operation
      2. 7.5.2 PSM Operation
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Custom Design With WEBENCH® Tools
         2. 8.2.2.2 Input Capacitor (CIN)
         3. 8.2.2.3 Output Capacitor (COUT)
         4. 8.2.2.4 Soft-start Capacitor (CSS)
         5. 8.2.2.5 Power Good Resistor (RPG)
         6. 8.2.2.6 Feedback Resistors (RFBB and RFBT)
      3. 8.2.3 Application Curves
         1. 8.2.3.1 VOUT = 1.2 V
         2. 8.2.3.2 VOUT = 1.8 V
         3. 8.2.3.3 VOUT = 2.5 V
         4. 8.2.3.4 VOUT = 3.3 V
         5. 8.2.3.5 VOUT = 5.0 V
   3. 8.3 Do's and Don'ts
9. 9 Power Supply Recommendations
   1. 9.1 Voltage Range
   2. 9.2 Current Capability
   3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Minimize the High di/dt Loop Area
       2. 10.1.2 Protect the Sensitive Nodes in the Circuit
       3. 10.1.3 Provide Thermal Path and Shielding
    2. 10.2 Layout Example
       1. 10.2.1 High Density Layout Example for Space Constrained Applications
          1. 10.2.1.1 35 mm² Solution Size (Single Sided)
11. 11器件和文檔支持
    1. 11.1 器件支持
       1. 11.1.1 開發(fā)支持
          1. 11.1.1.1 使用 WEBENCH® 工具創(chuàng)建定制設(shè)計
    2. 11.2 商標(biāo)
    3. 11.3 靜電放電警告
    4. 11.4 術(shù)語表
12. 12機械、封裝和可訂購信息
    1. 12.1 Tape and Reel Information