ZHCSD26E August 2012 – August 2018 LMZ21701
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMZ21701 | UNIT | |
|---|---|---|---|
| SIL (µSIP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 42.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 20.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 9.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.8 | °C/W |