ZHCSI00D April 2018 – September 2020 LMR36015
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 說(shuō)明（續(xù)）
- 6 Device Comparison Table
- 7 Pin Configuration and Functions
- 8 Specifications
- 9 Detailed Description
-
10Application and Implementation
- 10.1 Application Information
- 10.2
Typical Application
- 10.2.1
Design 1: Low Power 24-V, 1.5-A PFM Converter
- 10.2.1.1 Design Requirements
- 10.2.1.2
Detailed Design Procedure
- 10.2.1.2.1 Custom Design With WEBENCH Tools
- 10.2.1.2.2 Choosing the Switching Frequency
- 10.2.1.2.3 Setting the Output Voltage
- 10.2.1.2.4 Inductor Selection
- 10.2.1.2.5 Output Capacitor Selection
- 10.2.1.2.6 Input Capacitor Selection
- 10.2.1.2.7 CBOOT
- 10.2.1.2.8 VCC
- 10.2.1.2.9 CFF Selection
- 10.2.1.2.10 Maximum Ambient Temperature
- 10.2.2 Application Curves
- 10.2.3 Design 2: High Density 24-V, 1.5-A FPWM Converter
- 10.2.1
Design 1: Low Power 24-V, 1.5-A PFM Converter
- 10.3 What to Do and What Not to Do
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RNX|12
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RNX|12
訂購(gòu)信息
13.6 靜電放電警告
 |
靜電放電 (ESD) 會(huì)損壞這個(gè)集成電路。德州儀器 (TI) 建議通過(guò)適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會(huì)損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級(jí)，大至整個(gè)器件故障。精密的集成電路可能更容易受到損壞，這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會(huì)導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |