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ZHCSJY0B June 2012 – June 2019 LMR12015 , LMR12020

PRODUCTION DATA.

封裝選項

機械數(shù)據(jù) (封裝 | 引腳)

DSC|10
- MPDS239E

散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)

DSC|10
- QFND489A

訂購信息

6.3 Electrical Characteristics

Specifications with standard typeface are for T_J = 25°C, and those in boldface type apply over the full Operating Temperature Range (T_J = -40°C to 125°C). V_IN = 12V, and V_BOOST - V_SW = 4.3V unless otherwise specified. Datasheet min/max specification limits are ensured by design, test, or statistical analysis.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
SYSTEM PARAMETERS
V_FB	Feedback Voltage	T_J = 0°C to 85°C	0.990	1.0	1.010	V
V_FB	Feedback Voltage	T_J = -40°C to 125°C	0.984	1.0	1.014	V
ΔV_FB/ΔV_IN	Feedback Voltage Line Regulation	V_IN = 3V to 20V		0.003		% / V
I_FB	Feedback Input Bias Current			20	100	nA
OVP	Over Voltage Protection, V_FB at which PWM Halts.			1.13		V
UVLO	Undervoltage Lockout	V_IN Rising until V_SW is Switching	2.60	2.75	2.90	V
UVLO	UVLO Hysteresis	V_IN Falling from UVLO	0.30	0.47	0.6	V
SS	Soft Start Time		0.5	1	1.5	ms
I_Q	Quiescent Current, I_Q = I_{Q_AVIN} + I_{Q_PVIN}	V_FB = 1.1 (not switching)		2.4		mA
I_Q	Quiescent Current, I_Q = I_{Q_AVIN} + I_{Q_PVIN}	V_EN = 0V (shutdown)		70		nA
I_BOOST	Boost Pin Current	f_SW= 2 MHz		8.2	10	mA
I_BOOST	Boost Pin Current	f_SW= 1 MHz		4.4	6	mA
OSCILLATOR
f_SW	Switching Frequency	SYNC = GND	1.75	2	2.3	MHz
V_{FB_FOLD}	FB Pin Voltage where SYNC input is overridden.			0.53		V
f_{FOLD_MIN}	Frequency Foldback Minimum	V_FB = 0V		220	250	kHz
LOGIC INPUTS (EN, SYNC)
f_SYNC	SYNC Frequency Range		1		2.35	MHz
V_IL	EN, SYNC Logic low threshold	Logic Falling Edge			0.4	V
V_IH	EN, SYNC Logic high threshold	Logic Rising Edge	1.8			V
t_{SYNC_HIGH}	SYNC, Time Required above V_IH to Ensure a Logical High.		100			ns
t_{SYNC_LOW}	SYNC, Time Required below V_IL to Ensure a Logical Low.		100			ns
I_SYNC	SYNC Pin Current	V_SYNC < 5V		20		nA
I_EN	Enable Pin Current	V_EN = 3V		6	15	µA
I_EN	Enable Pin Current	V_IN = V_EN = 20V		50	100	µA
INTERNAL MOSFET
R_DS(ON)	Switch ON Resistance			150	320	mΩ
I_CL	Switch Current Limit	LMR12020	2.5		4.0	A
I_CL	Switch Current Limit	LMR12015	2.0		3.7	A
D_MAX	Maximum Duty Cycle	SYNC = GND	85	93%
t_MIN	Minimum on time			65		ns
I_SW	Switch Leakage Current			40		nA
BOOST LDO
V_LDO	Boost LDO Output Voltage			3.9		V
THERMAL
T_SHDN	Thermal Shutdown Temperature⁽³⁾	Junction temperature rising		165		°C
	Thermal Shutdown Hysteresis	Junction temperature hysteresis		15		°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2) Human body model, 1.5 kΩ in series with 100 pF.

(3) Thermal shutdown occurs if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient temperature is P_D = (T_J(MAX) – T_A)/θ_JA .

(4) All numbers apply for packages soldered directly onto a 3” × 3” PC board with 2 oz. copper on 4 layers in still air.

(5) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.