ZHCSN09A June 2021 – September 2022 LM5168-Q1 , LM5169-Q1
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Control Architecture
- 8.3.2 Internal VCC Regulator and Bootstrap Capacitor
- 8.3.3 Internal Soft Start
- 8.3.4 On-Time Generator
- 8.3.5 Current Limit
- 8.3.6 N-Channel Buck Switch and Driver
- 8.3.7 Synchronous Rectifier
- 8.3.8 Enable, Undervoltage Lockout (EN/UVLO)
- 8.3.9 Power Good (PGOOD)
- 8.3.10 Thermal Protection
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Fly-Buck? Converter Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Switching Frequency (RT)
- 9.2.2.2 Transformer Selection
- 9.2.2.3 Output Capacitor Selection
- 9.2.2.4 Secondary Output Diode
- 9.2.2.5 Setting Output Voltage
- 9.2.2.6 Input Capacitor
- 9.2.2.7 Type-3 Ripple Network
- 9.2.2.8 CBST Selection
- 9.2.2.9 Minimum Secondary Output Load
- 9.2.2.10 Example Design Summary
- 9.2.3 Application Curves
- 9.3 Typical Buck Application
- 9.4 Power Supply Recommendations
- 9.5 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
10.6 Electrostatic Discharge Caution
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |