ZHCSMW2B December 2021 – December 2022 LM5123-Q1
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | RGR (QFN) | UNIT | |
|---|---|---|---|
| 20 PINS | |||
| RqJA | Junction-to-ambient thermal resistance | 43.3 | °C/W |
| RqJC(top) | Junction-to-case (top) thermal resistance | 39.9 | °C/W |
| RqJB | Junction-to-board thermal resistance | 17.8 | °C/W |
| yJT | Junction-to-top characterization parameter | 0.8 | °C/W |
| yJB | Junction-to-board characterization parameter | 17.8 | °C/W |
| RqJC(bot) | Junction-to-case (bottom) thermal resistance | 5.3 | °C/W |