ZHCSHX3A December 2014 – March 2018 LDC1312 , LDC1314
PRODUCTION DATA.
Avoid long traces between the sensor and the LDC - higher frequency sensors may need to be placed closer to the device to minimize noise. The INAx and INBx traces should be routed as differential pairs - run the traces in parallel and close together. Lower trace impedances (even well below 100 Ω) are acceptable, as they reduce any parasitic inductance.
The sensor capacitor should be placed close to the inductor to minimize the sensor RP.
Do not place filled planes underneath or between the sensor layers. If the sensor is placed in a plane, there should be a gap of at least 20% of a sensor diameter between the plane and the outermost coil of the sensor. There should not be any continuous ring of conductors encircling the sensor. This can be managed with a small cut in the conductor.
Refer to the TI Application Note LDC Sensor Design for more information on sensor design and optimization.