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ZHCSKH7 November 2019 LDC1001

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

NHR|16
- MPDS426B

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

zhcskh7_oa

6.5 Electrical Characteristics

Unless otherwise specified, all limits ensured for T_A = T_J = 25°C, V_DD = 5 V, V_IO = 3.3 V⁽¹⁾⁽²⁾

PARAMETER		TEST CONDITIONS	MIN⁽³⁾	TYP⁽⁴⁾	MAX⁽³⁾	UNIT
POWER
V_DD	Analog supply voltage		4.75	5	5.25	V
V_IO	IO supply voltage	V_IO ≤ V_DD	1.8	3.3	5.25	V
I_DD	Supply current on VDD pin	PWR_MODE = 1, no sensor connected		1.7	2.3	mA
I_VIO	IO supply current	Static current			14	µA
I_{DD_LP}	Standby mode supply current on VDD pin	PWR_MODE = 0, no sensor connected		250		µA
t_START	Start-up time	From POR to ready-to-convert.		2		ms
LDC
ƒ_{SENSOR_MIN}	Minimum sensor frequency			5		kHz
ƒ_{SENSOR_MAX}	Maximum sensor frequency			5		MHz
A_{SENSOR_MIN}	Minimum sensor amplitude			1		V_PP
A_{SENSOR_MAX}	Maximum sensor amplitude			4		V_PP
t_REC	Recovery time	Oscillation start-up time after R_P under-range condition		10		1/ƒ_sensor
R_{P_MIN}	Minimum sensor R_P range			798		Ω
R_{P_MAX}	Maximum sensor R_P range			3.93		MΩ
R_{P_RES}	R_P measurement resolution			16		Bits
L Res	Inductance measurement resolution	RESPONSE_TIME = b111 (6144), ƒ_EXT = 8 MHz, ƒ_SENSOR = 5 kHz		24		Bits
t_{S_MIN}	Minimum response time	Minimum programmable settling time of digital filter		192/ƒ_SENSOR		s
t_{S_MAX}	Maximum response time	Maximum programmable settling time of digital filter		6144/ƒ_SENSOR		s
EXTERNAL CLOCK FOR FREQUENCY COUNTER
External Clock	Frequency				8	MHz
External Clock	Clock input high voltage				V_IO	V
DIGITAL I/O CHARACTERISTICS
V_IH	Logic 1 input voltage		0.8 × V_IO			V
V_IL	Logic 0 input voltage				0.2 × V_IO	V
V_OH	Logic 1 output voltage	I_SOURCE = 400 µA		V_IO–0.3		V
V_OL	Logic 0 output voltage	I_SINK = 400 µA			0.3	V
I_IOHL	Digital IO leakage current		–500		500	nA

(1) table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that T_J = T_A. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T_J > T_A. indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.

(2) The maximum power dissipation is a function of T_J(MAX), R_θJA, and the ambient temperature, T_A. The maximum allowable power dissipation at any ambient temperature is P_DMAX = (T_J(MAX) - T_A)/ R_θJA. All numbers apply for packages soldered directly onto a PCB. The package thermal impedance is calculated in accordance with JESD 51-7.

(3) Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through correlations using statistical quality control (SQC) method.

(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.