PGA309
- Complete Bridge Sensor Conditioner
- Voltage Output: Ratiometric or Absolute
- Digital Cal: No Potentiometers/Sensor Trims
- Sensor Error Compensation
- Span, Offset, and Temperature Drifts
- Low Error, Time-Stable
- Sensor Linearization Circuitry
- Temperature Sense: Internal or External
- Calibration Lookup Table Logic
- Uses External EEPROM (SOT23-5)
- Over/Under-Scale Limiting
- Sensor Fault Detection
- +2.7V TO +5.5V Operation
- –40°C to +125°C Operation
- Small TSSOP-16 Package
- APPLICATIONS
- Bridge Sensors
- Remote 4-20mA Transmitters
- Strain, Load, and Weigh Scales
- Automotive Sensors
- Hardware Designer’s Kit (PGA309EVM)
- Temperature Eval of PGA309 + Sensor
- Full Programming of PGA309
- Sensor Compensation Analysis Tool
All other trademarks are the property of their respective owners.
The PGA309 is a programmable analog signal conditioner designed for bridge sensors. The analog signal path amplifies the sensor signal and provides digital calibration for zero, span, zero drift, span drift, and sensor linearization errors with applied stress (pressure, strain, etc.). The calibration is done via a One-Wire digital serial interface or through a Two-Wire industry-standard connection. The calibration parameters are stored in external nonvolatile memory (typically SOT23-5) to eliminate manual trimming and achieve long-term stability.
The all-analog signal path contains a 2x2 input multiplexer (mux), auto-zero programmable-gain instrumentation amplifier, linearization circuit, voltage reference, internal oscillator, control logic, and an output amplifier. Programmable level shifting compensates for sensor dc offsets.
The core of the PGA309 is the precision, low-drift, no 1/f noise Front-End PGA (Programmable Gain Amplifier). The overall gain of the Front-End PGA + Output Amplifier can be adjusted from 2.7V/V to 1152V/V. The polarity of the inputs can be switched through the input mux to accommodate sensors with unknown polarity output. The Fault Monitor circuit detects and signals sensor burnout, overload, and system fault conditions.
For detailed application information, see the PGA309 User's Guide (SBOU024) available for download at www.ti.com.
技術文檔
設計和開發
如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。
MULTI-CAL-SYSTEM — Multi-Cal-System 基礎入門套件
Multi-Cal-System 是 EVM 和配件系統,可用于校準多個 PGA308 傳感器模塊。Multi-Cal-System 可配置為同時校準 8 至 64 個 PGA308。Multi-Cal-System 的關鍵組件是 Multi-Cal-System 入門套件。此套件包含:
- (1) Multi-Cal-Master 板
- (2) Multi-Cal-Test 板
- (1) Multi-Cal-Interface 板
- (2) Multi-Cal-Interface 電纜
- (1) Multi-Cal-Power 電纜
其他所有必需組件:USB-DAQ 平臺、軟件光盤、壁掛電源、USB (...)
PGA309EVM-USB — PGA309 評估模塊
PGA309EVM-USB 主要硬件由 2 塊電路板、PGA309 測試板和 USB DAQ 平臺組成。PGA309 測試板包含 PGA309、用于外部連接的端子臺、用于器件配置的多個跳線設置以及支持電路。PGA309 測試板可在您進行原型設計前對您的設計進行全面測試。USB DAQ 平臺包含一個具有內置 USB 接口的 8052 微處理器。此微處理器生成與 PGA309 進行通信所需的 1 線信號。USB DAQ 平臺還包含 3V/5V 可編程線性穩壓器、電源控制開關、通用數字 I/O、DAC 輸出和 A/D 輸入。該軟件是基于 windows 的圖形軟件,它允許用戶與 PGA309 (...)
SENSOREMULATOREVM — SensorEmulatorEVM 評估模塊
The SensorEmulatorEVM provides a complete system for strain and temperature emulation of voltage-excited bridge sensors. The SensorEmulatorEVM uses rotary selector switches and potentiometers to emulate the operation of a voltage-excited Wheatstone resistive bridge sensor at discrete operating (...)
SBOC394 — PGA309EVM-USB Source Code
支持的產品和硬件
SBOC401 — Multi-Cal-PGA309 System Software
支持的產品和硬件
產品
可編程和可變增益放大器(PGA 和 VGA)
硬件開發
評估板
SBOC065 — Generate Simulated Values
支持的產品和硬件
產品
可編程和可變增益放大器(PGA 和 VGA)
硬件開發
評估板
PSPICE-FOR-TI — PSpice? for TI 設計和仿真工具
借助?PSpice for TI 的設計和仿真環境及其內置的模型庫,您可對復雜的混合信號設計進行仿真。創建完整的終端設備設計和原型解決方案,然后再進行布局和制造,可縮短產品上市時間并降低開發成本。?
在?PSpice for TI 設計和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模擬仿真程序
TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會愛不釋手。
TINA 是德州儀器 (TI) 專有的 DesignSoft 產品。該免費版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需獲取可用 TINA-TI 模型的完整列表,請參閱:SpiceRack - 完整列表
需要 HSpice (...)
TIPD126 — Bridge sensor signal conditioner with current loop output and EMC protection reference design
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
訂購和質量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續可靠性監測
- 制造廠地點
- 封裝廠地點