SPRAAV1C May 2009 – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530
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PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
- Trademarks
- 1 Using This Guide
- 2 A Word of Caution
- 3 A Team Sport
- 4 Be Wary of Quotes
- 5 Don’t Forget Your CAD Tools
- 6 Metric Vs English
- 7 PCB Fab Limits
- 8 Routing and Layer Stackup
- 9 OMAP35x 0.4mm Pitch
- 10 Pad Type
- 11 PCB Pad Dimensions for 0.4mm BGA Package
- 12 Multiple BGA Packages
- 13 Etch Traps and Heat Sinks
- 14 Vias and VIP
- 15 Laser Blind Vias
- 16 Filled Vias
- 17 Know Your Tools
- 18 BeagleBoard
- 19 BeagleBoard Views
- 20 OMAP35x Decoupling
- 21 PCB Finishes for High Density Interconnect (HDI)
- 22 Real World Second Opinion
- 23 Acknowledgments
- 24 References
- Revision History
19 BeagleBoard Views
Each BeagleBoard layer is shown, with the image centered on the area underneath the OMAP35x.
The layer images are from the Allegro viewer with the appropriate pins, vias, and etch turned on for each layer. Except for the overall board picture shown in Figure 17, the area underneath the BGA package is the focal point. The image is always shown from the top.
The color code used is green for etch, blue for vias, gray for component pads, and blue-gray for the VIP.
The solid dark square is the OMAP35x outline and is retained for each subsequent layer.
Figure 18 is the top layer with the various pads and trace widths annotated.
Figure 18. BeagleBoard Top Layer Underneath the OMAP35x