SLUUC97B June 2020 – January 2025 UCC21222-Q1 , UCC21330-Q1
This section provides functional safety failure in time (FIT) rates for UCC21222-Q1 and UCC21330-Q1 based on two different industry-wide used reliability standards:
| FIT IEC TR 62380 / ISO 26262 | Power Dissipation (mW) | FIT (Failures Per 109 Hours) |
|---|---|---|
| Total component FIT rate | 10 | 20 |
| 100 | 21 | |
| 300 | 23 | |
| Die FIT rate | 10 | 2 |
| 100 | 3 | |
| 300 | 4 | |
| Package FIT rate | 10 | 18 |
| 100 | 18 | |
| 300 | 19 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS, BICMOS Digital, analog, or mixed | 20 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.