This section provides functional safety failure in time (FIT) rates for the SOIC package of UCC27289 based on two different industry-wide used reliability standards:

• Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
• Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

• Mission profile: Motor control from table 11 or figure 16
• Power dissipation: 10mW, 100mW, and 500mW
• Climate type: World-wide table 8 or figure 13
• Package factor (lambda 3): Table 17b or figure 15
• Substrate material: FR4
• EOS FIT rate assumed: 0 FIT

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.