ZHCSGC2I June 2017 – March 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390
PRODUCTION DATA
| THERMAL METRIC(1) | UCC53x0 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DWV (SOIC) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction–to-ambient thermal resistance | 109.5 | 119.8 | °C/W |
| RθJC(top) | Junction–to-case (top) thermal resistance | 43.1 | 64.1 | °C/W |
| RθJB | Junction–to-board thermal resistance | 51.2 | 65.4 | °C/W |
| ΨJT | Junction–to-top characterization parameter | 18.3 | 37.6 | °C/W |
| ΨJB | Junction–to-board characterization parameter | 50.7 | 63.7 | °C/W |