ZHCSKG7B June 2019 – February 2024 UCC5390-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC5390-Q1 | UNIT | ||
|---|---|---|---|---|
| DWV (SOIC) | ||||
| 8 PINS | ||||
| RθJA | Junction–to-ambient thermal resistance | 119.8 | °C/W | |
| RθJC(top) | Junction–to-case (top) thermal resistance | 64.1 | °C/W | |
| RθJB | Junction–to-board thermal resistance | 65.4 | °C/W | |
| ΨJT | Junction–to-top characterization parameter | 37.6 | °C/W | |
| ΨJB | Junction–to-board characterization parameter | 63.7 | °C/W | |