ZHCSIB2B December 2017 – October 2019 UCC28064A
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 說明 （續(xù)）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Principles of Operation
- 8.3.2 Natural Interleaving
- 8.3.3 On-Time Control, Maximum Frequency Limiting, Restart Timer and Input Voltage Feed-Forward compensation
- 8.3.4 Distortion Reduction
- 8.3.5 Zero-Current Detection and Valley Switching
- 8.3.6 Phase Management and Light-Load Operation
- 8.3.7 Burst Mode Operation
- 8.3.8 External Disable
- 8.3.9 Improved Error Amplifier
- 8.3.10 Soft Start
- 8.3.11 Brownout Protection
- 8.3.12 Line Dropout Detection
- 8.3.13 VREF
- 8.3.14 VCC
- 8.3.15
System Level Protections
- 8.3.15.1 Failsafe OVP - Output Over-voltage Protection
- 8.3.15.2 Overcurrent Protection
- 8.3.15.3 Open-Loop Protection
- 8.3.15.4 VCC Undervoltage Lock-Out (UVLO) Protection
- 8.3.15.5 Phase-Fail Protection
- 8.3.15.6 CS - Open, TSET - Open and Short Protection
- 8.3.15.7 Thermal Shutdown Protection
- 8.3.15.8 Fault Logic Diagram
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH® Tools
- 9.2.2.2 Inductor Selection
- 9.2.2.3 ZCD Resistor Selection RZA, RZB
- 9.2.2.4 HVSEN
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Selecting RS For Peak Current Limiting
- 9.2.2.7 Power Semiconductor Selection (Q1, Q2, D1, D2)
- 9.2.2.8 Brownout Protection
- 9.2.2.9 Converter Timing
- 9.2.2.10 Programming VOUT
- 9.2.2.11 Voltage Loop Compensation
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Package Option Addendum
- 13器件和文檔支持
- 14機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- D|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
9.2.2.7 Power Semiconductor Selection (Q1, Q2, D1, D2)
The selection of Q1, Q2, D1, and D2 are based on the power requirements of the design. For an explanation of how to select power semiconductor components for transition-mode PFC preregulators, refer to UCC38050 100-W Critical Conduction Power Factor Corrected (PFC) Pre-regulator.
The MOSFET (Q1, Q2) pulsed-drain maximum current is shown in Equation 38:
The MOSFET (Q1, Q2) RMS current calculation is shown in Equation 39:
To meet the power requirements of the design, IRFB11N50A 500-V MOSFETs were chosen for Q1 and Q2.
The boost diode (D1, D2) RMS current is shown in Equation 40:
To meet the power requirements of the design, MURS360T3, 600-V diodes were chosen for D1 and D2.