7.4 Thermal Information
| THERMAL METRIC |
UCC28064A |
UNIT |
| SOIC (D) |
| 16 PINS |
| RθJA |
Junction-to-ambient thermal resistance(4) |
91.6 |
°C/W |
| RθJC(top) |
Junction-to-case (top) thermal resistance(3) |
52.1 |
°C/W |
| RθJB |
Junction-to-board thermal resistance(2) |
48.6 |
°C/W |
| ψJT |
Junction-to-top characterization parameter(1) |
14.9 |
°C/W |
| ψJB |
Junction-to-board characterization parameter(5) |
48.3 |
°C/W |
(1) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(2) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).