Locate the UCC2773x-Q1 as close as possible to the MOSFETs in order to minimize the length of
high-current traces between the HO/LO and the Gates of MOSFETs/IGBTs, as well as the
return current path to the driver HS and COM from the Source/Emitter of the
MOSFET/IGBT.
Locate the VDD capacitor
(CVDD) and VHB capacitor (CBOOT) as close as possible to the
pins of the UCC2773x-Q1.
A 2Ω to 5Ω resistor in series with the
bootstrap diode is recommended to limit bootstrap current.
An RC filter with 1Ω to 51Ω resistance
and 10pF to 390pF capacitance for HI/LI is recommended.
Avoid LI, EN, and HI (driver input)
traces placed close to the HS node or any other high dV/dt traces that can induce
significant noise into the relatively high impedance leads.
Separate power traces and signal
traces, such as output and input signals.
Ensure there is not high switching
current flowing in the control ground (input signal reference) from the power train
ground.
On the split ground device, a separate
VDD–COM and VDD–VSS bypass capacitor should be used to reduce the impact of ground
bounce on the driver.