SLUSFV6 June 2025 UCC27302A-Q1
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | UCC27302A-Q1 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DDA (SOIC) | DRC (VSON) | |||
| 8 Pins | 8 Pins | 10 Pins | |||
| RθJA | Junction-to-ambient thermal resistance | 112.5 | 44.8 | 51.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.1 | 68.5 | 58.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.6 | 20 | 24.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7 | 6.9 | 1.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58.7 | 20 | 24.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | 8.4 | 9.2 | °C/W |