Packaging Information
| Orderable Device |
Status(1) |
Package Type |
Package Drawing |
Pins |
Package Qty |
Eco Plan(2) |
Lead/Ball Finish(6) |
MSL Peak Temp(3) |
Op Temp (°C) |
Device Marking(4)(5) |
| UCC23525CDWYR |
PREVIEW |
SOIC |
DWY |
6 |
850 |
RoHS & Green |
NIPDAU |
Level-2-260C-1 YEAR |
-40 to 125 |
|
(1) The marketing status values are
defined as follows:
ACTIVE: Product device
recommended for new designs.
LIFEBUY: TI
has announced that the device will be discontinued, and a lifetime-buy period is
in effect.
NRND: Not recommended for new
designs. Device is in production to support existing customers, but TI does not
recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for
mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production.
Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned
eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green
(RoHS & no Sb/Br) - please check
www.ti.com/productcontent for the latest availability information
and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or
"Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not
exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at
high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder
bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to
mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based
flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous
material).
(3) MSL, Peak Temp. -- The Moisture
Sensitivity Level rating according to the JEDEC industry standard
classifications, and peak solder temperature.
(4) There may be additional marking,
which relates to the logo, the lot trace code information, or the environmental
category on the device.
(5) Multiple Device markings will be
inside parentheses. Only one Device Marking contained in parentheses and
separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire
Device Marking for that device.
(6) Lead/Ball Finish - Orderable
Devices may have multiple material finish options. Finish options are separated
by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
| Important Information and
Disclaimer: The information provided on this page represents
TI's knowledge and belief as of the date that it is provided. TI
bases its knowledge and belief on information provided by third
parties, and makes no representation or warranty as to the accuracy
of such information. Efforts are underway to better integrate
information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information
but may not have conducted destructive testing or chemical analysis
on incoming materials and chemicals. TI and TI suppliers consider
certain information to be proprietary, and thus CAS numbers and
other limited information may not be available for release. |
| In no event shall TI's
liability arising out of such information exceed the total purchase
price of the TI part(s) at issue in this document sold by TI to
Customer on an annual basis. |