ZHCSO28A December 2020 – May 2021 TS3DV642-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TS3DV642-Q1 | UNIT | |
|---|---|---|---|
| RUA | |||
| 42 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 28.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 16.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 9.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.9 | °C/W |