ZHCSIS1G January 2005 – January 2019 TS3A5017
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics for 3.3-V Supply
- 6.6 Electrical Characteristics for 2.5-V Supply
- 6.7 Switching Characteristics for 3.3-V supply
- 6.8 Switching Characteristics for 2.5-V supply
- 6.9 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- PW|16
- DBQ|16
- RGY|16
- D|16
- DGV|16
- RSV|16
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
D, DBQ, DGV, and PW Package
16-Pin SOIC, SSOP, TVSOP and TSSOP
(Top View)
RGY Package
16-Pin VQFN
(Top View)
If exposed center pad is used, it must be connected as a secondary ground or left electrically open.
RSV Package
16-Pin UQFN
(Top View)
Pin Functions
| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | SOIC, SSOP, TVSOP, TSSOP, VQFN NO. | UQFN NO. | ||
| 1D | 7 | 5 | I/O | Common path for switch 1 |
| 1EN | 1 | 15 | I | Active-low enable for switch 1 |
| 1S1 | 6 | 4 | I/O | Switch 1 channel 1 |
| 1S2 | 5 | 3 | I/O | Switch 1 channel 2 |
| 1S3 | 4 | 2 | I/O | Switch 1 channel 3 |
| 1S4 | 3 | 1 | I/O | Switch 1 channel 4 |
| 2D | 9 | 7 | I/O | Common path for switch 2 |
| 2EN | 15 | 13 | I | Active-low enable for switch 2 |
| 2S1 | 10 | 8 | I/O | Switch 2 channel 1 |
| 2S2 | 11 | 9 | I/O | Switch 2 channel 2 |
| 2S3 | 12 | 10 | I/O | Switch 2 channel 3 |
| 2S4 | 13 | 11 | I/O | Switch 2 channel 4 |
| GND | 8 | 6 | – | Ground |
| IN1 | 14 | 12 | I | Switch 1 input select |
| IN2 | 2 | 16 | I | Switch 2 input select |
| V+ | 16 | 14 | – | Supply voltage |