| THERMAL METRIC(1) | TPSM53604 | UNIT |
|---|
| RDA (QFN) |
|---|
| 15 PINS |
|---|
| RθJA | Junction-to-ambient thermal resistance (2) | 19.5 | °C/W |
| ψJT | Junction-to-top characterization parameter (3) | 1.0 | °C/W |
| ψJB | Junction-to-board characterization parameter (4) | 5.5 | °C/W |
| TSHDN | Thermal shutdown temperature | 165 | °C |
| Recovery temperature | 148 | °C |
(2) The junction-to-ambient thermal resistance, R
θJA, applies to devices soldered directly to a 75 mm x 75 mm four-layer PCB with 2 oz. copper and natural convection cooling. Additional airflow and PCB copper area reduces R
θJA. For more information, see the
Section 10.3 section.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.