ZHCSPG4D december 2021 – august 2023 TPS7A14
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Circuit reliability demands that proper consideration be given to device power dissipation, location of the circuit on the printed circuit board (PCB), and correct sizing of the thermal plane. The PCB area around the regulator must be as free as possible of other heat-generating devices that cause added thermal stresses.
Equation 2 calculates the maximum allowable power dissipation for the device in a given package:
Equation 3 represents the actual power being dissipated in the device:
If the load current is much greater than IGND(IN) and IGND(BIAS) Equation 3 can be simplified as:
Power dissipation can be minimized, and thus greater efficiency achieved, by proper selection of the system voltage rails. Proper selection allows the minimum input-to-output voltage differential to be obtained. The low dropout of the TPS7A14 allows for maximum efficiency across a wide range of output voltages.
The main heat conduction path depends on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air.
The maximum allowable junction temperature (TJ) determines the maximum power dissipation for the device. According to Equation 5, maximum power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient air (TA). The equation is rearranged in Equation 6 for output current.
Unfortunately, this thermal resistance (RθJA) is highly dependent on the heat-spreading capability built into the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded in the Electrical Characteristics table is determined by the JEDEC standard, PCB, and copper-spreading area, and is only used as a relative measure of package thermal performance. For a well-designed thermal layout, RθJA is actually the sum of the YBK package junction-to-case (bottom) thermal resistance (RθJC(bot)) plus the thermal resistance contribution by the PCB copper.