ZHCSSB2G march 2008 – june 2023 TPS799-Q1
PRODUCTION DATA
| THERMAL METRIC(1)(2) | TPS799-Q1 | UNIT | ||
|---|---|---|---|---|
| DRV (SON) | DDC (SOT-23) | |||
| 6 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 74.2 | 178.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 58.8 | 70.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 145.9 | 73.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | 2.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 54.4 | 74.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.2 | n/a | °C/W |