ZHCSSO4E September 2010 – September 2024 TPS74801-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPS74801-Q1 | UNIT | ||||
|---|---|---|---|---|---|---|
| RGW (VQFN) (legacy chip) | RGW (VQFN) (new chip) | DRC (VSON) (legacy chip) | DRC (VSON) (new chip) | |||
| 20 PINS | 20 PINS | 10 PINS | 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 35.6 | 34.7 | 44.2 | 47.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.3 | 31 | 50.3 | 63.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15 | 13.5 | 19.6 | 19.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | 1.4 | 0.7 | 4.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 15.2 | 13.5 | 17.8 | 19.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.8 | 3.6 | 4.3 | 3.3 | °C/W |