9 Revision History
Changes from Revision D (December 2023) to Revision E (September 2024)
- Added VIN Dropout Voltage vs (VBIAS –
VOUT) and Temperature (TA) curve to Typical
Characteristics: IOUT = 50 mA sectionGo
- Added active pulldown to Legacy Chip Functional Block Diagram
and added New Chip Functional Block Diagram
Go
Changes from Revision C (July 2023) to Revision D (December 2023)
- 通篇添加了器件措辭以區(qū)分舊芯片和新芯片信息Go
- 更改了說明 部分：更改了導(dǎo)通響應(yīng) 圖并為新芯片添加了溫度范圍Go
- Changed Typical Characteristics sections to show legacy chip
and new chip data side by side and deleted VIN Dropout Voltage vs
VBIAS-VOUT
curvesGo
- Changed images in Estimating Junction
Temperature sectionGo
- Deleted RGW Example figure from Layout Example
sectionGo
- Added Device Nomenclature sectionGo