ZHCSIY2B July 2018 – August 2021 TPS65988
PRODUCTION DATA
The TPS65988 features a central thermal shutdown as well as independent thermal sensors for each internal power path. The central thermal shutdown monitors the overall temperature of the die and disables all functions except for supervisory circuitry when die temperature goes above a rising temperature of TSD_MAIN. The temperature shutdown has a hysteresis of TSDH_MAIN and when the temperature falls back below this value, the device resumes normal operation.
The power path thermal shutdown monitors the temperature of each internal power path and disables the power path in response to an over temperature event. Once the temperature falls below TSDH_PWR the path can be configured to resume operation or remain disabled until re-enabled by firmware.