ZHCSIY2B July 2018 – August 2021 TPS65988
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Supply Requirements and Characteristics
- 6.6 Power Consumption Characteristics
- 6.7 Power Switch Characteristics
- 6.8 Cable Detection Characteristics
- 6.9 USB-PD Baseband Signal Requirements and Characteristics
- 6.10 BC1.2 Characteristics
- 6.11 Thermal Shutdown Characteristics
- 6.12 Oscillator Characteristics
- 6.13 I/O Characteristics
- 6.14 PWM Driver Characteristics
- 6.15 I2C Requirements and Characteristics
- 6.16 SPI Controller Timing Requirements
- 6.17 HPD Timing Requirements
- 6.18 Typical Characteristics
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 USB-PD Physical Layer
- 8.3.2 Power Management
- 8.3.3 Port Power Switches
- 8.3.4 Cable Plug and Orientation Detection
- 8.3.5 Dead Battery Operation
- 8.3.6 Battery Charger Detection and Advertisement
- 8.3.7 ADC
- 8.3.8 DisplayPort HPD
- 8.3.9 Digital Interfaces
- 8.3.10 PWM Driver
- 8.3.11 Digital Core
- 8.3.12 I2C Interfaces
- 8.3.13 SPI Controller Interface
- 8.3.14 Thermal Shutdown
- 8.3.15 Oscillators
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1 Type-C VBUS Design Considerations
- 9.2.2 Dual Port Thunderbolt Notebook with AR Supporting USB PD Charging
- 9.2.3 Dual Port USB & Displayport Notebook Supporting PD Charging
- 9.2.4 USB Type-C & PD Monitor/Dock
- 10Power Supply Recommendations
-
11Layout
- 11.1 Layout Guidelines
- 11.2 Layout Example
- 11.3 Stack-Up and Design Rules
- 11.4 Main Component Placement
- 11.5 1.4 Super Speed Type-C Connectors
- 11.6 Capacitor Placement
- 11.7 CC1/2 Capacitors & ADCIN1/2 Resistors
- 11.8 CC & SBU Protection Placement
- 11.9 CC Routing
- 11.10 DRAIN1 and DRAIN2 Pad Pours
- 11.11 USB2 Routing for ESD Protection and BC1.2
- 11.12 VBUS Routing
- 11.13 Completed Layout
- 11.14 Power Dissipation
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |