ZHCSIY2B July   2018  – August 2021 TPS65988

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Power Supply Requirements and Characteristics
   6. 6.6  Power Consumption Characteristics
   7. 6.7  Power Switch Characteristics
   8. 6.8  Cable Detection Characteristics
   9. 6.9  USB-PD Baseband Signal Requirements and Characteristics
   10. 6.10 BC1.2 Characteristics
   11. 6.11 Thermal Shutdown Characteristics
   12. 6.12 Oscillator Characteristics
   13. 6.13 I/O Characteristics
   14. 6.14 PWM Driver Characteristics
   15. 6.15 I2C Requirements and Characteristics
   16. 6.16 SPI Controller Timing Requirements
   17. 6.17 HPD Timing Requirements
   18. 6.18 Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
         1. 8.3.1.1 USB-PD Encoding and Signaling
         2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
         3. 8.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
         4. 8.3.1.4 USB-PD BMC Transmitter
         5. 8.3.1.5 USB-PD BMC Receiver
      2. 8.3.2  Power Management
         1. 8.3.2.1 Power-On And Supervisory Functions
         2. 8.3.2.2 VBUS LDO
         3. 8.3.2.3 Supply Switch Over
      3. 8.3.3  Port Power Switches
         1. 8.3.3.1 PP_HV Power Switch
            1. 8.3.3.1.1 PP_HV Over Current Clamp
            2. 8.3.3.1.2 PP_HV Over Current Protection
            3. 8.3.3.1.3 PP_HV OVP and UVP
            4. 8.3.3.1.4 PP_HV Reverse Current Protection
         2. 8.3.3.2 Schottky for Current Surge Protection
         3. 8.3.3.3 PP_EXT Power Path Control
         4. 8.3.3.4 PP_CABLE Power Switch
            1. 8.3.3.4.1 PP_CABLE Over Current Protection
            2. 8.3.3.4.2 PP_CABLE Input Good Monitor
         5. 8.3.3.5 VBUS Transition to VSAFE5V
         6. 8.3.3.6 VBUS Transition to VSAFE0V
      4. 8.3.4  Cable Plug and Orientation Detection
         1. 8.3.4.1 Configured as a DFP
         2. 8.3.4.2 Configured as a UFP
         3. 8.3.4.3 Configured as a DRP
         4. 8.3.4.4 Fast Role Swap Signaling
      5. 8.3.5  Dead Battery Operation
         1. 8.3.5.1 Dead Battery Advertisement
         2. 8.3.5.2 BUSPOWER (ADCIN1)
      6. 8.3.6  Battery Charger Detection and Advertisement
         1. 8.3.6.1 BC1.2 Data Contact Detect
         2. 8.3.6.2 BC1.2 Primary and Secondary Detection
         3. 8.3.6.3 Charging Downstream Port Advertisement
         4. 8.3.6.4 Dedicated Charging Port Advertisement
         5. 8.3.6.5 2.7V Divider3 Mode Advertisement
         6. 8.3.6.6 1.2V Mode Advertisement
         7. 8.3.6.7 DCP Auto Mode Advertisement
      7. 8.3.7  ADC
      8. 8.3.8  DisplayPort HPD
      9. 8.3.9  Digital Interfaces
         1. 8.3.9.1 General GPIO
         2. 8.3.9.2 I2C
         3. 8.3.9.3 SPI
      10. 8.3.10 PWM Driver
      11. 8.3.11 Digital Core
      12. 8.3.12 I2C Interfaces
          1. 8.3.12.1 I2C Interface Description
          2. 8.3.12.2 I2C Clock Stretching
          3. 8.3.12.3 I2C Address Setting
          4. 8.3.12.4 Unique Address Interface
          5. 8.3.12.5 I2C Pin Address Setting (ADCIN2)
      13. 8.3.13 SPI Controller Interface
      14. 8.3.14 Thermal Shutdown
      15. 8.3.15 Oscillators
   4. 8.4 Device Functional Modes
      1. 8.4.1 Boot
      2. 8.4.2 Power States
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Type-C VBUS Design Considerations
         1. 9.2.1.1 Design Requirements
         2. 9.2.1.2 Detailed Design Procedure
            1. 9.2.1.2.1 External Sink Power Path Options
               1. 9.2.1.2.1.1 Load Switch Power Path
               2. 9.2.1.2.1.2 Discrete Power Path
            2. 9.2.1.2.2 Type-C Connector VBUS Capacitors
            3. 9.2.1.2.3 VBUS Schottky and TVS Diodes
            4. 9.2.1.2.4 VBUS Snubber Circuit
         3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Port Thunderbolt Notebook with AR Supporting USB PD Charging
         1. 9.2.2.1 Design Requirements
         2. 9.2.2.2 USB Power Delivery Source Capabilities
         3. 9.2.2.3 USB Power Delivery Sink Capabilities
         4. 9.2.2.4 Supported Data Modes
         5. 9.2.2.5 RESETN
         6. 9.2.2.6 I2C Design Requirements
         7. 9.2.2.7 TS3DS10224 SBU Mux for AUX and LSTX/RX
         8. 9.2.2.8 Thunderbolt Flash Options
      3. 9.2.3 Dual Port USB & Displayport Notebook Supporting PD Charging
         1. 9.2.3.1 Design Requirements
         2. 9.2.3.2 USB Power Delivery Source Capabilities
         3. 9.2.3.3 USB Power Delivery Sink Capabilities
         4. 9.2.3.4 Supported Data Modes
         5. 9.2.3.5 TUSB1044 Re-Driver GPIO Control
      4. 9.2.4 USB Type-C & PD Monitor/Dock
         1. 9.2.4.1 Design Requirements
         2. 9.2.4.2 Detailed Design Procedure
            1. 9.2.4.2.1 USB Power Delivery Source Capabilities
            2. 9.2.4.2.2 USB and DisplayPort Supported Data Modes
            3. 9.2.4.2.3 TUSB1064 Super Speed Mux GPIO Control
10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
       1. 10.1.1 VIN_3V3 Input Switch
       2. 10.1.2 VBUS 3.3-V LDO
    2. 10.2 1.8-V Power
    3. 10.3 Recommended Supply Load Capacitance
11. 11Layout
    1. 11.1  Layout Guidelines
    2. 11.2  Layout Example
    3. 11.3  Stack-Up and Design Rules
    4. 11.4  Main Component Placement
    5. 11.5  1.4 Super Speed Type-C Connectors
    6. 11.6  Capacitor Placement
    7. 11.7  CC1/2 Capacitors & ADCIN1/2 Resistors
    8. 11.8  CC & SBU Protection Placement
    9. 11.9  CC Routing
    10. 11.10 DRAIN1 and DRAIN2 Pad Pours
    11. 11.11 USB2 Routing for ESD Protection and BC1.2
    12. 11.12 VBUS Routing
    13. 11.13 Completed Layout
    14. 11.14 Power Dissipation
12. 12Device and Documentation Support
    1. 12.1 Device Support
       1. 12.1.1 第三方產(chǎn)品免責(zé)聲明
       2. 12.1.2 Firmware Warranty Disclaimer
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 術(shù)語(yǔ)表
13. 13Mechanical, Packaging, and Orderable Information