ZHCSIH9F March 2009 – July 2018 TPS65023-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TPS65023-Q1 | UNIT | ||
|---|---|---|---|---|
| RHA (VQFN) | RSB (WQFN) | |||
| 40 PINS | 40 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.6 | 34.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.2 | 14.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 6.6 | 6.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 6.5 | 6.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | 1.3 | °C/W |