ZHCSL70D March 2020 – October 2020 TPS63900
PRODUCTION DATA
| THERMAL METRIC(1) | TPS63900 | UNIT | |
|---|---|---|---|
| DSK Package (WSON) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 64.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 62.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 31.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 31.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 10.0 | °C/W |