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ZHCS165B April 2011 – October 2014 TPS55010

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

RTE|16
- MPQF149D

散熱焊盤機械數據 (封裝 | 引腳)

RTE|16
- QFND290G

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings ⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
Voltage	VIN	–0.3	7	V
	EN	–0.3	3.6	V
	BOOT		PH + 7	V
	VSENSE	–0.3	3	V
	COMP	–0.3	3	V
	FAULT	–0.3	7	V
	SS	–0.3	3	V
	RT/CLK	–0.3	6	V
	BOOT-PH	–0.3	7	V
	PH	–0.6	7	V
	PH, 10ns Transient	–2	10	V
Current	EN		100	µA
	RT/CLK		100	µA
	COMP		100	uA
	FAULT		10	mA
	SS		100	µA
Operating Junction Temperature		–40	150	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ELECTRICAL SPECIFICATIONS is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Rating

over operating free-air temperature range (unless otherwise noted)

			MIN	MAX	UNIT
T_stg	Storage Temperature		–65	150	°C
V_(ESD)	Electrostatic Discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins ⁽¹⁾	–2	2	kV
V_(ESD)	Electrostatic Discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins ⁽²⁾	–500	500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
V_I	Input voltage	2.98		6	V
P_O	Output power			2	W

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS55010	UNIT
THERMAL METRIC⁽¹⁾		RTE (16 PINS)	UNIT
θ_JA	Junction-to-ambient thermal resistance	60	°C/W
θ_JCtop	Junction-to-case (top) thermal resistance	55.5
θ_JB	Junction-to-board thermal resistance	24.9
ψ_JT	Junction-to-top characterization parameter	1.0
ψ_JB	Junction-to-board characterization parameter	24.9
θ_JCbot	Junction-to-case (bottom) thermal resistance	9.9

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

T_J = –40°C TO 150°C, VIN = 2.95V TO 6V (unless otherwise noted)

DESCRIPTION	CONDITIONS	MIN	TYP	MAX	UNIT
SUPPLY VOLTAGE
Operating input voltage	VIN	2.95		6	V
Shutdown current	EN = 0V, 25°C		2	5	µA
Operating current	VSENSE = 0.9V, 25°C		360	575	µA
Internal undervoltage lockout			2.6	2.9	V
ENABLE
Enable threshold	rising		1.25	1.37	V
Enable threshold	falling	1.15	1.18
Input current	Threshold - 50mV		–1.2		µA
Input current	Threshold + 50mV		–4.6		µA
Hysteresis			3.4		µA
VOLTAGE REFERENCE
Reference	3V < VIN < 6V	0.804	0.829	0.854	V
MOSFET
High side switch resistance	BOOT- PH = 5 V		45	81	mΩ
Low side switch resistance	VIN = 5 V		45	81	mΩ
ERROR AMPLIFIER
Input current			50		nA
Error amp transconductance	-2 µA < I_(COMP)< 2 µA		245		uS
Error amp dc gain	VSENSE = 0.8 V		500		V/V
Minimum unity gain Bandwidth			3		MHz
Error amp source/sink	V_(COMP) = 1V, 100 mV overdrive		±16		µA
COMP to Iph gm	I_(PH) = 0.5 A		7.5		A/V
CURRENT LIMIT
High side sourcing current limit	VIN = 3 V	2	2.75		A
Low Side Sinking Current Limit	VIN = 3 V	–3	–4.5		A
THERMAL SHUTDOWN
Thermal Shutdown			171		°C
OT Hysteresis			12		°C
RT/CLK
RT/CLK voltage	R_(RT/CLK)= 195 kΩ		0.5		V
RT/CLK high threshold			1.6	2.2	V
RT/CLK low threshold		0.4	0.6		V
BOOT
Boot UVLO			2.5		V
SS Slow Start
Charge current	V_(SS) = 0.4 V	0.5	2.2	4	µA
SS to VSENSE matching	V_(SS) = 0.4 V		35		mV
SS to reference Crossover	98% reference		1.1		V
SS discharge current (overload)	VSENSE = 0 V		325		µA
SS discharge voltage	VSENSE = 0V		46		mV
SS discharge current (UVLO, EN, thermal fault)	V_(SS) = 0.5 V		1.2		mA
VIN UVLO to SS start time			100		µs
FAULT Pin
VSENSE threshold	VSENSE falling		91		% VREF
VSENSE threshold	VSENSE rising		108		% VREF
Output high leakage	VSENSE = V_REF, V_(FAULT) = 5.5 V		2		nA
Output low	I_(FAULT) = 3 mA		0.3		V
Minimum VIN for valid output	V_(FAULT) < 0.5 V at 100 µA			1.6	V

7.6 Timing Requirements

		MIN	TYP	MAX	UNIT
RT/CLK
Minimum CLK pulse width			75		ns

7.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
PH
t_on	Minimum on time	Measured at 10% to 10% of VIN		130		ns
t_off	Minimum off time	V_(BOOT-PH) ≥ 3 V		0%
RT/CLK
	Switching frequency using CLK mode		300		2000	kHz
	Switching frequency using RT mode		100		2000	kHz
	Switching Frequency	R_(RT/CLK) = 195 kΩ	400	500	600	kHz
	PLL lock in time			50		µs
	RT/CLK falling edge to PH rising edge delay			90		ns
SS Slow Start
	VIN UVLO to SS start time			100		µs