ZHCS165B April 2011 – October 2014 TPS55010
PRODUCTION DATA.
Layout is a critical portion of good power supply design. There are several signal paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. Care should be taken to minimize the loop area formed by the bypass capacitor connections and the VIN pins. See Figure 55 for a PCB layout example. The GND pins should be tied directly to the thermal pad under the IC. The power pad should be connected to any internal PCB ground planes using multiple vias directly under the IC. Additional vias can be used to connect the top side ground area to the internal planes near the input and output capacitors.
Figure 55. PCB Layout Example