ZHCSQY3 march 2023 TPS546D24S
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Average Current-Mode Control
- 7.3.2 Linear Regulators
- 7.3.3 AVIN and PVIN Pins
- 7.3.4 Input Undervoltage Lockout (UVLO)
- 7.3.5 Start-Up and Shutdown
- 7.3.6 Differential Sense Amplifier and Feedback Divider
- 7.3.7 Set Output Voltage and Adaptive Voltage Scaling (AVS)
- 7.3.8 Prebiased Output Start-Up
- 7.3.9 Soft Stop and (65h) TOFF_FALL Command
- 7.3.10 Power Good (PGOOD)
- 7.3.11 Set Switching Frequency
- 7.3.12 Frequency Synchronization
- 7.3.13 Loop Follower Detection
- 7.3.14 Current Sensing and Sharing
- 7.3.15 Telemetry
- 7.3.16 Overcurrent Protection
- 7.3.17 Overvoltage/Undervoltage Protection
- 7.3.18 Overtemperature Management
- 7.3.19 Fault Management
- 7.3.20 Back-Channel Communication
- 7.3.21 Switching Node (SW)
- 7.3.22 PMBus General Description
- 7.3.23 PMBus Address
- 7.3.24 PMBus Connections
- 7.4 Device Functional Modes
- 7.5 Programming
- 7.6
Register Maps
- 7.6.1 Conventions for Documenting Block Commands
- 7.6.2 (01h) OPERATION
- 7.6.3 (02h) ON_OFF_CONFIG
- 7.6.4 (03h) CLEAR_FAULTS
- 7.6.5 (04h) PHASE
- 7.6.6 (10h) WRITE_PROTECT
- 7.6.7 (15h) STORE_USER_ALL
- 7.6.8 (16h) RESTORE_USER_ALL
- 7.6.9 (19h) CAPABILITY
- 7.6.10 (1Bh) SMBALERT_MASK
- 7.6.11 (1Bh) SMBALERT_MASK_VOUT
- 7.6.12 (1Bh) SMBALERT_MASK_IOUT
- 7.6.13 (1Bh) SMBALERT_MASK_INPUT
- 7.6.14 (1Bh) SMBALERT_MASK_TEMPERATURE
- 7.6.15 (1Bh) SMBALERT_MASK_CML
- 7.6.16 (1Bh) SMBALERT_MASK_OTHER
- 7.6.17 (1Bh) SMBALERT_MASK_MFR
- 7.6.18 (20h) VOUT_MODE
- 7.6.19 (21h) VOUT_COMMAND
- 7.6.20 (22h) VOUT_TRIM
- 7.6.21 (24h) VOUT_MAX
- 7.6.22 (25h) VOUT_MARGIN_HIGH
- 7.6.23 (26h) VOUT_MARGIN_LOW
- 7.6.24 (27h) VOUT_TRANSITION_RATE
- 7.6.25 (29h) VOUT_SCALE_LOOP
- 7.6.26 (2Bh) VOUT_MIN
- 7.6.27 (33h) FREQUENCY_SWITCH
- 7.6.28 (35h) VIN_ON
- 7.6.29 (36h) VIN_OFF
- 7.6.30 (37h) INTERLEAVE
- 7.6.31 (38h) IOUT_CAL_GAIN
- 7.6.32 (39h) IOUT_CAL_OFFSET
- 7.6.33 (40h) VOUT_OV_FAULT_LIMIT
- 7.6.34 (41h) VOUT_OV_FAULT_RESPONSE
- 7.6.35 (42h) VOUT_OV_WARN_LIMIT
- 7.6.36 (43h) VOUT_UV_WARN_LIMIT
- 7.6.37 (44h) VOUT_UV_FAULT_LIMIT
- 7.6.38 (45h) VOUT_UV_FAULT_RESPONSE
- 7.6.39 (46h) IOUT_OC_FAULT_LIMIT
- 7.6.40 (47h) IOUT_OC_FAULT_RESPONSE
- 7.6.41 (4Ah) IOUT_OC_WARN_LIMIT
- 7.6.42 (4Fh) OT_FAULT_LIMIT
- 7.6.43 (50h) OT_FAULT_RESPONSE
- 7.6.44 (51h) OT_WARN_LIMIT
- 7.6.45 (55h) VIN_OV_FAULT_LIMIT
- 7.6.46 (56h) VIN_OV_FAULT_RESPONSE
- 7.6.47 (58h) VIN_UV_WARN_LIMIT
- 7.6.48 (60h) TON_DELAY
- 7.6.49 (61h) TON_RISE
- 7.6.50 (62h) TON_MAX_FAULT_LIMIT
- 7.6.51 (63h) TON_MAX_FAULT_RESPONSE
- 7.6.52 (64h) TOFF_DELAY
- 7.6.53 (65h) TOFF_FALL
- 7.6.54 (78h) STATUS_BYTE
- 7.6.55 (79h) STATUS_WORD
- 7.6.56 (7Ah) STATUS_VOUT
- 7.6.57 (7Bh) STATUS_IOUT
- 7.6.58 (7Ch) STATUS_INPUT
- 7.6.59 (7Dh) STATUS_TEMPERATURE
- 7.6.60 (7Eh) STATUS_CML
- 7.6.61 (7Fh) STATUS_OTHER
- 7.6.62 (80h) STATUS_MFR_SPECIFIC
- 7.6.63 (88h) READ_VIN
- 7.6.64 (8Bh) READ_VOUT
- 7.6.65 (8Ch) READ_IOUT
- 7.6.66 (8Dh) READ_TEMPERATURE_1
- 7.6.67 (98h) PMBUS_REVISION
- 7.6.68 (99h) MFR_ID
- 7.6.69 (9Ah) MFR_MODEL
- 7.6.70 (9Bh) MFR_REVISION
- 7.6.71 (9Eh) MFR_SERIAL
- 7.6.72 (ADh) IC_DEVICE_ID
- 7.6.73 (AEh) IC_DEVICE_REV
- 7.6.74 (B1h) USER_DATA_01 (COMPENSATION_CONFIG)
- 7.6.75 (B5h) USER_DATA_05 (POWER_STAGE_CONFIG)
- 7.6.76 (D0h) MFR_SPECIFIC_00 (TELEMETRY_CONFIG)
- 7.6.77 (DAh) MFR_SPECIFIC_10 (READ_ALL)
- 7.6.78 (DBh) MFR_SPECIFIC_11 (STATUS_ALL)
- 7.6.79 (DCh) MFR_SPECIFIC_12 (STATUS_PHASE)
- 7.6.80 (E3h) MFR_SPECIFIC_19 (PGOOD_CONFIG)
- 7.6.81 (E4h) MFR_SPECIFIC_20 (SYNC_CONFIG)
- 7.6.82 (ECh) MFR_SPECIFIC_28 (STACK_CONFIG)
- 7.6.83 (EDh) MFR_SPECIFIC_29 (MISC_OPTIONS)
- 7.6.84 (EEh) MFR_SPECIFIC_30 (PIN_DETECT_OVERRIDE)
- 7.6.85 (EFh) MFR_SPECIFIC_31 (DEVICE_ADDRESS)
- 7.6.86 (F0h) MFR_SPECIFIC_32 (NVM_CHECKSUM)
- 7.6.87 (F1h) MFR_SPECIFIC_33 (SIMULATE_FAULT)
- 7.6.88 (FAh) MFR_SPECIFIC_42 (PASSKEY)
- 7.6.89 (FBh) MFR_SPECIFIC_43 (EXT_WRITE_PROTECT)
- 7.6.90 (FCh) MFR_SPECIFIC_44 (FUSION_ID0)
- 7.6.91 (FDh) MFR_SPECIFIC_45 (FUSION_ID1)
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Custom Design With WEBENCH? Tools
- 8.2.2.2 Switching Frequency
- 8.2.2.3 Inductor Selection
- 8.2.2.4 Output Capacitor Selection
- 8.2.2.5 Input Capacitor Selection
- 8.2.2.6 AVIN, BP1V5, VDD5 Bypass Capacitor
- 8.2.2.7 Bootstrap Capacitor Selection
- 8.2.2.8 R-C Snubber
- 8.2.2.9 Output Voltage Setting (VSEL Pin)
- 8.2.2.10 Compensation Selection (MSEL1 Pin)
- 8.2.2.11 Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
- 8.2.2.12 Enable and UVLO
- 8.2.2.13 ADRSEL
- 8.2.2.14 Pin-Strapping Resistor Selection
- 8.2.2.15 BCX_CLK and BCX_DAT
- 8.2.3 Application Curves
- 8.3
Two-Phase Application
- 8.3.1 Design Requirements
- 8.3.2 Switching Frequency
- 8.3.3 Inductor Selection
- 8.3.4 Output Capacitor Selection
- 8.3.5 Input Capacitor Selection
- 8.3.6 AVIN, BP1V5, VDD5 Bypass Capacitor
- 8.3.7 Bootstrap Capacitor Selection
- 8.3.8 R-C Snubber
- 8.3.9 Output Voltage Setting (VSEL Pin)
- 8.3.10 Compensation Selection (MSEL1 Pin)
- 8.3.11 GOSNS/FLWR Pin of Loop Follower Devices
- 8.3.12 Soft Start, Overcurrent Protection, and Stacking Configuration (MSEL2 Pin)
- 8.3.13 Enable, UVLO
- 8.3.14 VSHARE Pin
- 8.3.15 SYNC Pin
- 8.3.16 VOSNS Pin of Loop Follower Devices
- 8.3.17 Unused Pins of Loop Follower Devices
- 8.3.18 Two-phase Application Curves
- 8.4 Four-Phase Application
- 8.5 Power Supply Recommendations
- 8.6 Layout
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
8.6.3 Mounting and Thermal Profile Recommendation
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the reflow process can affect electrical performance. Figure 8-19 shows the recommended reflow-oven thermal profile. Proper post-assembly cleaning is also critical to device performance. Refer to QFN and SON PCB Attachment application report for more information.
Figure 8-19 Recommended Reflow-Oven Thermal ProfileTable 8-3 Recommended Thermal Profile Parameters
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| RAMP UP AND RAMP DOWN | |||||
| rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
| rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
| PRE-HEAT | |||||
| TS | Preheat temperature | 150 | 200 | °C | |
| tS | Preheat time, TS(min) to TS(max) | 60 | 180 | s | |
| REFLOW | |||||
| TL | Liquidus temperature | 217 | °C | ||
| TP | Peak temperature | 260 | °C | ||
| tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
| tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
| t25P | Total time from 25°C to peak temperature, TP | 480 | s | ||