C(RX): Place C(RX1) and C(RX2) in line with the CC1 and CC2 traces as shown in Figure 25. These should be placed within one inch from the Type C connector. Minimize stubs and tees from on the trace routes.
Q1: Place Q1 in a manner such that power flows uninterrupted from Q1 drain to the Type C connector VBUS connections. Provide adequate copper plane from Q1 drain and source to the interconnecting circuits.
RS: Place RS as shown in Figure 72 to facilitate uninterrupted power flow to the Type C connector. Orient RS for optimal Kelvin sense connection/routing back to the TPS25740B. In high current applications where the power dissipation is over 250 mW, provide an adequate copper feed to the pads of RS.
RG: Place RG near Q1 as shown in Figure 72. Minimize stray leakage paths as the GDNG sourcing current could be affected.
R(SLEW)/C(SLEW): Place R(SLEW) and C(SLEW) near RG as shown in Figure 72.
R(DSCG): Place on top of the VBUS copper route and connect to the DSCG pin with a 15 mil trace.
RF/CF: When required, place RF and CF as shown in Figure 72 to facilitate the Kelvin sense connection back to the device.
C(VBUS)/D(VBUS): Place C(VBUS) and D(VBUS) within one inch of the Type C connector and connect them to VBUS and GND using adequate copper shapes.
R(SEL)/R(PCTRL): Place R(SEL) and R(PCTRL) near the device.