ZHCSJY9B June   2019  – November 2021 TPS1HB50-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
   1. 6.1 Recommended Connections for Unused Pins
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 SNS Timing Characteristics
   7. 7.7 Switching Characteristics
   8. 7.8 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Protection Mechanisms
         1. 9.3.1.1 Thermal Shutdown
         2. 9.3.1.2 Current Limit
            1. 9.3.1.2.1 Current Limit Foldback
            2. 9.3.1.2.2 Programmable Current Limit
            3. 9.3.1.2.3 Undervoltage Lockout (UVLO)
            4. 9.3.1.2.4 VBB During Short-to-Ground
         3. 9.3.1.3 Voltage Transients
            1. 9.3.1.3.1 Load Dump
            2. 9.3.1.3.2 Driving Inductive Loads
         4. 9.3.1.4 Reverse Battery
         5. 9.3.1.5 Fault Event – Timing Diagrams
      2. 9.3.2 Diagnostic Mechanisms
         1. 9.3.2.1 VOUT Short-to-Battery and Open-Load
            1. 9.3.2.1.1 Detection With Switch Enabled
            2. 9.3.2.1.2 Detection With Switch Disabled
         2. 9.3.2.2 SNS Output
            1. 9.3.2.2.1 RSNS Value
               1. 9.3.2.2.1.1 High Accuracy Load Current Sense
               2. 9.3.2.2.1.2 SNS Output Filter
         3. 9.3.2.3 Fault Indication and SNS Mux
         4. 9.3.2.4 Resistor Sharing
         5. 9.3.2.5 High-Frequency, Low Duty-Cycle Current Sensing
   4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Standby
      3. 9.4.3 Diagnostic
      4. 9.4.4 Standby Delay
      5. 9.4.5 Active
      6. 9.4.6 Fault
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Ground Protection Network
       2. 10.1.2 Interface With Microcontroller
       3. 10.1.3 I/O Protection
       4. 10.1.4 Inverse Current
       5. 10.1.5 Loss of GND
       6. 10.1.6 Automotive Standards
          1. 10.1.6.1 ISO7637-2
          2. 10.1.6.2 AEC-Q100-012 Short Circuit Reliability
       7. 10.1.7 Thermal Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1 Thermal Considerations
          2. 10.2.2.2 RILIM Calculation
          3. 10.2.2.3 Diagnostics
             1. 10.2.2.3.1 Selecting the RISNS Value
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Documentation Support
       1. 13.1.1 Related Documentation
    2. 13.2 接收文檔更新通知
    3. 13.3 支持資源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 術(shù)語(yǔ)表
14. 14Mechanical, Packaging, and Orderable Information