ZHCSIV1F September 2018 – February 2023 TPS1663
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TPS1663 | UNIT | ||
|---|---|---|---|---|
| RGE (VSON) | PWP (HTSSOP) | |||
| 24 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.4 | 32.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 23.2 | 23.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 10.2 | 10 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 10.2 | 9.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.8 | 3.6 | °C/W |