ZHCSFE0B August 2016 – February 2022 TPD1E10B06-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UNIT | |||
|---|---|---|---|---|
| DPY (X1SON) | DYA (SOD523) | |||
| 2 PINS | 2 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 615.5 | 730.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 404.8 | 413.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 493.3 | 497.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 127.7 | 129.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 493.3 | 491.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 162 | - | °C/W |