ZHCSSN8 july 2023 TMUXHS221LV
PRODUCTION DATA
| THERMAL METRIC(1) | TMUXHS221LV | UNIT | |
|---|---|---|---|
| NKG (UQFN) | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance - High K | 225.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 93.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 147.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 147.1 | °C/W |