ZHCSK56A August 2019 – July 2020 TMUX1208-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TMUX1208-Q1 | UNIT | |
|---|---|---|---|
| RSV (QFN) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 134.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 74.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 62.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 61.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |